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Chen, Chixiao and Yin, Jieming and Peng, Yarui and Palesi, Maurizio and Cao, Wenxu and Huang, Letian and Singh, Amit Kumar and Zhi, Haocong and Wang, Xiaohang (2022) Design Challenges of Intra- and Inter- Chiplet Interconnection. IEEE Design and Test, 39 (6). pp. 99-109. DOI https://doi.org/10.1109/mdat.2022.3203005
Singh, Amit Kumar and Dey, Somdip and Basireddy, Karunakar Reddy and McDonald-Maier, Klaus and Merrett, Geoff V and Al-Hashimi, Bashir M (2020) Dynamic Energy and Thermal Management of Multi-Core Mobile Platforms: A Survey. IEEE Design and Test, 37 (5). pp. 25-33. DOI https://doi.org/10.1109/mdat.2020.2982629